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Amaoe 0.15mm Qualcomm QCN6274 WiFi7 Wireless Module IC Chip BGA Reballing Stencil Image 1
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Amaoe 0.15mm Qualcomm QCN6274 WiFi7 Wireless Module IC Chip BGA Reballing Stencil

$3.00 $3.99


Tags:

CPU BGA Tools


Categories:

Repair Tools
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  • Description

iProGadgets Repair Tools Amaoe 0.15mm Qualcomm QCN6274 WiFi7 Wireless Module IC Chip BGA Reballing Stencil

Package includes:
  • 1 x Stencil