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Description
Mechanic Heat Kit Intelligent Reflow Soldering Heating Platform With Stencil For iPhone 11-13Pro Max Motherboard Layered Welding
Features:
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Reflow soldering heating platform, 5 professional mode selection, 3 common mode operation
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Especially for the original solder of mobile phone motherboard, curve heating, intelligent and safe desoldering and reflow
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The traditional single heating element is banned, and the new MCH ceramic double heating element is adopted, which has faster heating, more uniform temperature, and stable performance
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5 application scene modes of degumming, layering, lamination, tin planting, and welding can be switched arbitrarily
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3 commonly used memory temperatures, automatic recording of the current temperature (save when power is off) and manual recording of the current temperature mode
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Turbofan blades for heat dissipation, built-in strong wind cooling system, the fan adapts the speed according to the temperature to dissipate heat
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Monitor temperature changes and realize reflow soldering temperature curve data monitoring
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Real-time detection of motherboard heating and cooling temperature, no need to switch interface to view
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Scope of application: For iPhone X/XS/XS Max/11/11 Pro/11Pro Max/12 Mini/12/ 12 Pro/12Pro Max/13 Mini/13/13 Pro/13Pro Max
Key Description:
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"Add button" click to adjust the temperature, long press to start heating
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"Minus key" click to adjust the temperature, long press to start cooling
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"MEM key" click to switch three temperature memory, long press to set the memory temperature
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"SET button" click to switch five modes, long press to set the mode temperature
Package includes:
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1 x Host
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1 x Power Cord
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6 x Modules
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12 x Steel mesh
