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Description
Qianli BGA Reballing Stencil for EMMC EMCP BGA162 BGA254 BGA186 BGA153 BGA169 BGA221 Soldering Template Thickness 0.12mm
Description:
--High quality BGA Stencil.
--Specially designed for EMMC/EMCP BGA162 BGA254 BGA186 BGA153 BGA169 BGA221.
--Material : Steel.
--Thickness : 0.12mm.
Memo: This is not an easy job for someone who has no technical skills with Disassembling or Assembling Cellphones/mobile phones, so only purchase this item if you know how to install it. Highly recommend professional installation. We will not be held responsible for any damages to your cellphone/mobile phone that you may cause during the changing of replacement parts.
Before Shipping:
Our QC Will Test the Parts and Assure it is 100% Good Function Before Shipping.
Description:
--High quality BGA Stencil.
--Specially designed for EMMC/EMCP BGA162 BGA254 BGA186 BGA153 BGA169 BGA221.
--Material : Steel.
--Thickness : 0.12mm.
Memo: This is not an easy job for someone who has no technical skills with Disassembling or Assembling Cellphones/mobile phones, so only purchase this item if you know how to install it. Highly recommend professional installation. We will not be held responsible for any damages to your cellphone/mobile phone that you may cause during the changing of replacement parts.
Before Shipping:
Our QC Will Test the Parts and Assure it is 100% Good Function Before Shipping.
