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Description
Qianli Multi-Function Universal BGA Reballing Stencil 0.3 0.35 0.4 0.5 Square Hole Solder Template 0.12mm 0.35x35x35 0.35x48x48 0.3x50x50 0.4x32x32 0.5x38x38 0.4x48x48 0.4x50x50 0.4x25x25
Function: Reballing universal IC pins.
Thickness : 0.12mm
Material : Steel
Memo: This is not an easy job for someone who has no technical skills with Disassembling or Assembling Cellphones/mobile phones, so only purchase this item if you know how to install it. Highly recommend professional installation. We will not be held responsible for any damages to your cellphone/mobile phone that you may cause during the changing of replacement parts.
Before Shipping:
Our QC Will Test the Parts and Assure it is 100% Good Function Before Shipping.
Function: Reballing universal IC pins.
Thickness : 0.12mm
Material : Steel
Memo: This is not an easy job for someone who has no technical skills with Disassembling or Assembling Cellphones/mobile phones, so only purchase this item if you know how to install it. Highly recommend professional installation. We will not be held responsible for any damages to your cellphone/mobile phone that you may cause during the changing of replacement parts.
Before Shipping:
Our QC Will Test the Parts and Assure it is 100% Good Function Before Shipping.
