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Description
iProGadgets Repair Tools Relife RL-044 0.12mm Middle Layer BGA Reballing Stencil for iPhone 16 / 16 Plus / 16 Pro / 16 Pro Max
Package includes:
1 x Stencil
Notice:
Remove the heat dissipation sticker on the bottom of the motherboard then plant the tin, please remove the steel stencil before heating!!!
Package includes:
1 x Stencil
Notice:
Remove the heat dissipation sticker on the bottom of the motherboard then plant the tin, please remove the steel stencil before heating!!!
