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Description
Description:
The Sunshine SS-T12B Multi-functional Universal Intelligent Maintenance Heating Platform, a cutting-edge solution designed to elevate your repair and maintenance work. This platform offers an array of exceptional features that redefine convenience and efficiency.
Versatile Compatibility: With support for both Android and iPhone series devices, including the iPhone 7 to 14Pro Max models, this platform caters to a wide range of repair needs. Whether it's motherboard bonding and separation or screen frame disassembly, the SS-T12B has got you covered, with ongoing updates to ensure continued relevance.
Precise Temperature Control: Experience smart temperature control tailored to different melting points. This platform ensures fast heating, extended lifespan, and consistent temperature distribution.
Innovative Modular Design: The modular architecture allows seamless integration of a variety of modules. Common modules on the base ensure excellent scalability, making it effortless to incorporate new modules.
Expansive Heating Area: Boasting a generous heating area, this platform is well-suited for desoldering and maintenance of diverse motherboard components. Its enhanced compatibility ensures quicker and more convenient operations.
Effortless Handling: The 360° rotating buckle and guide rail design enable meticulous clamping of motherboards of various shapes, enhancing overall repair efficiency. The module quick-release buckle simplifies module swapping, promoting seamless transitions during repair tasks.
Precision at Its Core: Equipped with positioning columns, the module guarantees accurate separation and attachment to the motherboard. This precision ensures swift and reliable repair processes.
Enhanced Safety and Stability: The platform's hollow heat dissipation design guarantees efficient heat management even during prolonged use. Silicone wear-resistant foot pads provide stability, preventing slips and enhancing overall safety.
The Sunshine SS-T12B Multi-functional Universal Intelligent Maintenance Heating Platform revolutionizes repair and maintenance work with its forward-thinking features. Streamline your processes, enhance accuracy, and elevate efficiency with this exceptional tool. Please note to exercise caution regarding residual heat before module replacement post-heating.
The Modules use for:
- T12B-IP1: Common for most models of screen bracket separation/fingerprint repair/CPU chip degumming/face repair
- T12B-IP2: Fingerprint repair/A12/A11/X/XS/XSM motherboard delamination
- T12B-IP3: iPhone 11/11P/11PM/A13 motherboard layering
- T12B-IP4: CPU chip degumming/12/12Mini/12P/12PM motherboard layering
- T12B-IP5: iPhone 13/13Mini/13P/13PM/A15 motherboard layering
- T12B-IP6: iPhone 14/14Plus/14P/14PM/A15/A16 motherboard layering
- T12B-IP7: iPhone X/XR/XS/XSM/12P/12PM/13/13Mini camera
- T12B-IP8: iPhone 11/11P/11PM/13P/13PM camera
- T12B-IP9: iPhone 7G/7P/8G/8P/11/12/12Min/14/14Plus/14P/14PM camera
- T12B-IP10: Android universal(included in the main host)
