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XZZ TR16 Mid Layer Tin Planting Positioning Plate Frame Reballing Stencil Platform for iPhone X-16Pro Max Motherboard Repair Image 1
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XZZ TR16 Mid Layer Tin Planting Positioning Plate Frame Reballing Stencil Platform for iPhone X-16Pro Max Motherboard Repair Image 2
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XZZ TR16 Mid Layer Tin Planting Positioning Plate Frame Reballing Stencil Platform for iPhone X-16Pro Max Motherboard Repair Image 4
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XZZ TR16 Mid Layer Tin Planting Positioning Plate Frame Reballing Stencil Platform for iPhone X-16Pro Max Motherboard Repair Nav Image 1
XZZ TR16 Mid Layer Tin Planting Positioning Plate Frame Reballing Stencil Platform for iPhone X-16Pro Max Motherboard Repair Nav Image 2
XZZ TR16 Mid Layer Tin Planting Positioning Plate Frame Reballing Stencil Platform for iPhone X-16Pro Max Motherboard Repair Nav Image 3
XZZ TR16 Mid Layer Tin Planting Positioning Plate Frame Reballing Stencil Platform for iPhone X-16Pro Max Motherboard Repair Nav Image 4

XZZ TR16 Mid Layer Tin Planting Positioning Plate Frame Reballing Stencil Platform for iPhone X-16Pro Max Motherboard Repair

$25.00 $29.99


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CPU BGA Tools


Categories:

Repair Tools
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  • Description

iProGadgets Repair Tools XZZ TR16 Mid Layer Tin Planting Positioning Plate Frame Reballing Stencil Platform for iPhone X-16Pro Max Motherboard Repair

Features:
  • Support the new iPhone 16 series middle frame rebelling platfrom, support iPhone X-16 series tin plating
  • Support iPhone X/11/12/13/14/15/16 series cell phone motherboard tinning and subsequent continuous upgrade, and the base universal after the module to avoid repeated purchases
  • Magnetic stability, built in three large magnets, which can tightly connect the steel mesh with the tin planting table
  • Shaking the product in your hand, the magnetism still persists, vigorously shaking without falling off, preventing poor tin plating effect caused by steel mesh movement
  • High-precision equipment processing and manufacturing, with errors close to zero, improve maintenance efficiency, and avoids repeated operations due to insufficient solder paste
  • Take the steel mesh from the corners to avoid large areas of mesh detachment at the same time, which may cause the solder paste to be taken away
  • Synthetic stone raw materials, green environmental protection tense, high temperature
  • resistance, high strength, dirt resistance, easy-to-clean
  • Crafted with precision,wear-resistant, and high toughness, selected high-quality steel to create steel mesh, with good rebound performance and long-lasting durability
Step-by-step demonstration:
  • Put the tinning table into the magnetic base, and fix the motherboard that needs to be tinned in the corresponding slot of the tinning table
  • Please take out the corresponding tinning stencil and place it in the tinning table to align with the lamination
  • Use the tin scraper to apply the solder paste evenly in the mesh of the tinning net
  • Remove the stencil, and then use a hot air gun to heat and blow until the solder paste melts
Package includes:
  • According to your choice