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Description
iProGadgets Repair Tools YCS Lead-free High Temperature Drop Point Free Disassembly Comprehensive Paste for Mobile Phone Repair Welding Repair Flux Tools
Description:
YCS Lead-free High-Temperature Drop Point Paste for mobile phone repair.
Designed to remove oxidation from layer pads
No-clean solder flux for PCB circuit board BGA chip soldering repair.
Easy to tin, greatly improves welding efficiency.
Description:
YCS Lead-free High-Temperature Drop Point Paste for mobile phone repair.
Designed to remove oxidation from layer pads
No-clean solder flux for PCB circuit board BGA chip soldering repair.
Easy to tin, greatly improves welding efficiency.
Features:
Solder insulation, no short circuit, less smoke, soldering mobile phone chips and precision circuits,
Toothpaste box packaging design, no need for an additional push rod to open the lid.
To prevent solidification clogging, the lid has a built-in anti-clogging rod,
Product Capacity: 15ml
